Advantage
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Expanding C5 derivative chain product development through ring-opening polymerization technology
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Low dielectric property(Dk/Df ≦ 3.0/ 0.002 @10GHz)
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Having the resin formulations technology, it has the potential for applicaiton
Product Introduction
Low dielectric constant, low loss, and excellent high-frequency electrical characteristics, widely used in high-frequency substrates, bonding sheet, and more
Contact Us
Customized services can be provided according to customer needs. Contact us by using the ↘Form Online↙ or the information on the right side.
- Name：Ken
- TEL：+88676117136#8238
- Mobile：+886910796274
- E-mail：[email protected]